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| Phase Diagrams |
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| Metal-Oxide-Semiconductor
Devices
· The diagram shows an MOS device that employs silicon technology. The interconnections between the active components of the structure are an Al-Cu alloy, and tungsten studs are used to make connections between the layers of the six-layer structure. Device dimensions are at the 0.5 micron scale and layer thicknesses are on the order of a few hundred nanometers. |
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